National University of Kaohsiung X ASE Group

International Master Scholarship Program

Introduction

This master's program is in cooperation with ASE. Semiconductor Manufacturing Co., Ltd. according to its company's development needs. The main goal of this program is to cultivate international professionals required for semiconductor packaging and testing. This program mainly integrates the courses related to semiconductor production automation technology such as smart production, electromechanical integration, Internet of Things technology, and advanced semiconductor packaging process. Through one year of school teaching and one year of internship training in ASE., students will earn a Master's degree of Engineering (M.S.) and work at ASE Kaohsiung in Taiwan.

Programme Structure

• Advanced semiconductor physics and engineering
• Object oriented programming
• Microelectronic plastic packaging materials
• Material surface analysis
• Semiconductor packaging reliability analysis
• Intelligent software simulation technology
• Smart manufacturing project management
• Internship: Industrial practice

Related Links

National University of Kaohsiung (English):https://www.nuk.edu.tw/?Lang=en

Study at NUK - By a foreign student (English): https://www.youtube.com/watch?v=Y9u1569fPUI&t=89s

ASE Group (English)：https://ase.aseglobal.com/en

ASE Turnkey Solutions(English)：https://youtu.be/mtPgHEUuWrA

Welcome students from Philippines to join us!

Further inquiries, please write to cfyang@nuk.edu.tw
(Attn: Prof. Cheng-Fu Yang, Department of Chemical and Materials Engineering)

Date last revised: 8/11/2022